Biteam Exhibits at JEC 2008 As every year, Biteam exhibited at JEC. This year's highlights were the Family of Pi Profiles and Truss Weave which drew immense interest from aerospace, aeronautical and engineering industries. Biteam Co-sponsored the First World Conference on 3D Fabrics and Their Applications The first Conference on 3D Fabrics and Their Applications organized by TexEng Software Ltd. in association with The University of Manchester School of Materials, UK, was co-sponsored by Biteam. The paper ‘Second Generation Woven Profiled 3D Fabrics from 3D-Weaving’ was presented which clearly established the versatility and flexibility of the 3D-weaving process over 3D-braiding and so-called 3D weaving processes which are technically a non-woven process called uniaxial noobing. Biteam participates in MOJO project Nandan Khokar, Profiling Performance, Pioneer of 3D-weaving technologies, Biteam